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Image Design’s MIM10S1 Wins the 2026 “China Core” Outstanding Technological Inno
On November 2, 2026, the 2026 “China Core” Integrated Circuit Industry Promotion Conference and the 21st “China Core” Outstanding Product Selection Results Release Ceremony, themed “Intelligence Empowers the Chip Journey, Collaboration for Shared Growth,” were held at the Hengqin Tianmu Qintai Convention and Exhibition Center, with coordinated events in Macao. During the “Outstanding Product Selection Results Release” session of the main forum on the afternoon of November 2, MIM10S1, an image sensor module independently developed by Chengdu Image Design Technology Co., Ltd. (“Image Design”), was awarded the “Outstanding Technological Innovation Product” award for its systematic innovations in ultra-compact size, high dynamic range, and high signal-to-noise ratio imaging. Mr. Liu Hao, Vice President of Image Design, took the stage to receive the award on behalf of the company.
The “China Core” Integrated Circuit Industry Promotion Conference is one of the most professional and influential annual events in China’s integrated circuit sector. This year’s conference brought together chip companies, research institutions, industrial capital, and upstream and downstream partners across the industrial chain, showcasing the year’s innovation achievements in domestic integrated circuits. Image Design’s MIM10S1 stood out among numerous submitted products, marking a technological breakthrough by domestic CMOS image sensors in medical endoscopic imaging applications and earning recognition once again from a national-level industry platform.

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Ultra-Compact Size and High-Definition Imaging

MIM10S1 is a miniature image sensor module launched by Image Design for applications including disposable medical endoscopes, veterinary medical endoscopes, and high-precision industrial endoscopes. It is designed to address the industry’s core pain points of “seeing clearly” and “being small.” The medical endoscopic module MIM10S1 was developed on a 55nm + 55nm BSI 3D Stack process. While scaling the pixel down to 1.008μm, the product significantly increases the photosensitive area per pixel through a stacked design of the pixel layer and the logic layer, solving the challenge of insufficient sensitivity in small pixels. To improve image quality, the company innovatively introduced BCF isolation and DTI (deep trench isolation) technologies to suppress optical crosstalk between microlenses and electrical crosstalk between pixels, respectively, enabling more accurate color reproduction and higher edge resolution. As a result, MIM10S1 achieves a dynamic range of over 70dB and readout noise below 1.4e⁻, delivering well-defined gradation and clean dark areas across a depth-of-field range of 3mm to 50mm.
In addition, within an extremely small footprint of 1.05mm × 1.05mm, Image Design integrates a 720 × 720 pixel array, an on-chip ADC, and an LVDS digital transmission interface. It is not only suitable for ultra-slim endoscopic devices such as flexible ureteroscopes and bronchoscopes, but also, through an all-digital output path, completely eliminates the risk of interference that traditional analog signals face in long-cable transmission, supports stable transmission over distances of up to 4 meters, and significantly enhances the reliability and stability of the overall system.

                                                                     

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Market Insights and Strategic Planning

Since its founding in 2014, Image Design has consistently focused on independent innovation in CMOS image sensor technology. Leveraging an end-to-end R&D system, the company has built a product matrix covering security, automotive, industrial, medical, and other sectors. The award-winning MIM10S1 exemplifies the results of its long-term deep cultivation of medical endoscopy applications. In his acceptance speech, Vice President Liu Hao said: “The award for MIM10S1 affirms Image Design’s sustained investment in medical imaging technology. We will take this award as a new starting point, continue to deepen our focus on the medical endoscopy segment, and, with more reliable domestically produced components and more comprehensive solutions, help domestic medical devices win greater customer trust in the high-end market.”
This year’s “China Core” selection attracted hundreds of companies from across the country. The award won by Image Design’s MIM10S1 not only recognizes its technological strength, but also reflects the positive trend of domestic chips achieving key technological breakthroughs in the medical endoscopy field and moving toward the high-end market. In the future, Image Design will continue to use innovation as its engine, collaborate with industry chain partners, and help domestic image sensors secure a more important position in the global high-end medical imaging market.