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Image Design Made Its Appearance at CCME2025 Global Medical Device Innovation Co
On July 24-25, 2025, at the CCME2025 Global Medical Device Innovation Conference & 9th Endoscopy Congress held at Nanjing Yangtze River International Conference Center, Chengdu Image Design Technology Co., Ltd. (hereinafter referred to as "Image Design"), a domestic CMOS image sensor supplier, made its official appearance at Booth B032 in the Supply Chain Hall (Hall A). Song Bo, the company's Head of Marketing, will deliver a keynote speech titled "The Path to Localization of Endoscopic CMOS Chips" at the Endoscope Design & Manufacturing Technology Conference on July 25 at 13:55. He will share the company's groundbreaking achievements in the field of medical endoscopy chips.


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MIM10C1: A Feature Breakdown

At the CCME2025 conference, Image Design highlighted its MIM10C1 disposable endoscope module. This miniaturized module features a compact integrated design, making it suitable for single-use electronic endoscopes, veterinary medicine, and industrial inspection. Users can optionally integrate micro LED lighting to enhance imaging performance in low-light cavity environments.
The key breakthrough lies in its LVDS signal technology, which offers three main advantages: Its differential signal transmission effectively cancels out external electromagnetic interference, ensuring stable performance over long cables (3-6 meters). With only four essential interfaces (VDD, VSS, SDA/DATA+, SCL/DATA-), the design is greatly simplified. This reduces connection complexity, minimizes errors and compatibility issues, and ultimately improves both R&D and production efficiency. These features make the MIM10C1 an ideal solution for precise diagnostic applications.

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MIM10C1 Key Capabilities

The MIM10C1 achieves low power consumption (21.784mW @2.8V) and a high rate (40fps at 10-bit), delivering outstanding performance in practical tests. Data confirms exceptional clarity within a 3-50mm working distance. For instance, in a banknote detail test, it demonstrates a marked improvement in clarity.

Test of Palm Details

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Accelerating Product Development

Image Design is set to accelerate its product iteration with multiple new product releases planned between 2025 and 2027.For single-use flexible endoscopes, the company continues to push physical limits in pursuit of extreme miniaturization, aiming to reduce the package size by 70% within three years (from 1.05mm to 0.3mm). This will further minimize the invasiveness of endoscopic procedures. Within the same form factor, resolution will be continuously improved. The sensors will simultaneously integrate LOFIC (Lateral Overflow Integration Capacitor - anti-overexposure) and NIR (Near-Infrared - fluorescence imaging) technologies, enhancing clarity while maintaining miniaturization. Furthermore, the chips will evolve in intelligence, transitioning from pure sensors to integrated "sensing + processing" solutions.Upcoming products will incorporate enhanced LOFIC and NIR technologies. LOFIC technology addresses overexposure in bright areas by using DCG sampling and HD-MIM capacitors to manage overflow electrons. NIR technology optimizes sensitivity at the 850nm wavelength, significantly improving imaging precision in deep tissues and the efficiency of fluorescent marker identification, meeting the demands of high-end applications like endoscopy.

In terms of process innovation, Image Design adopts BSI 3D Stack technology. This not only reduces pixel size but also enhances light sensitivity, increases resolution, and enables digital output. Additionally, Deep Trench Isolation (DTI) technology effectively minimizes charge leakage and improves color crosstalk isolation.

Rooted in its commitment to a fully localized supply chain, Image Design is relentlessly pushing the boundaries of medical CIS technology. We cordially invite global partners to visit us at Booth B032 in Hall A on July 24-25 to witness the power of innovation in domestic chips.