【On December 20, 2024】, the General Assembly of the China Automotive Chip Industry Innovation Strategic Alliance (CACISA) and the inaugural conference of the Shanghai Automotive-Grade IC Industry Innovation Alliance were grandly held in Shanghai, signifying a critical advancement in China's automotive semiconductor sector. The event brought together Tang Wenkan (Deputy Director of Shanghai Municipal Commission of Economy and Informatization), Ke Xiaolin (Deputy District Mayor of Minhang District), Academician Wu Hanming of the Chinese Academy of Engineering, along with automotive industry leaders, semiconductor experts, and representatives from across the industrial chain. The conference featured a comprehensive agenda, including the General Assembly, Global Summit Forum, 'China Core' Supply-Demand Matchmaking Conference, Power Semiconductor Symposium, Exhibition, and multiple thematic presentations, establishing a vital platform for collaboration and innovation within China's automotive chip ecosystem.
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Establishment of Shanghai Automotive-Grade Integrated Circuit Industry Alliance
Amidst the strategic development phase where China prioritizes the integrated circuit industry as a top-tier industrial chain, and leveraging Shanghai's positioning of IC as one of its three pillar industries, the China Automotive Chip Industry Innovation Strategic Alliance (CACISA) and Shanghai Anzhixin Automotive-Grade IC Co., Ltd. (Anzhixin) jointly launched the Shanghai Automotive-Grade IC Full Industry Chain Technology Innovation Strategic Alliance. Rooted in the Yangtze River Delta and serving the entire industrial chain, the Alliance converges multi-stakeholder forces from enterprises, universities, research institutions, and industry associations. Guided by the philosophy of 'cross-boundary integration, mutual success, industrial chain consolidation, and ecosystem alliance,' it aims to vertically integrate upstream and downstream sectors—spanning semiconductor equipment, advanced materials, chip design, wafer manufacturing, packaging and testing, testing and certification, software algorithms, and vehicle applications—to construct a self-innovative ecosystem for China's automotive chip industry.
The signing of the cooperation agreement between Anzhixin (Shanghai Anzhixin Automotive-Grade IC Co., Ltd.) and the China Automotive Chip Industry Innovation Strategic Alliance (CACISA) formally inaugurates the establishment of the Shanghai Automotive-Grade IC Full Industry Chain Technology Innovation Industrial Alliance. This collaboration will jointly advance the growth of the automotive and semiconductor industries in Shanghai and East China, foster synergies across the entire automotive chip industrial chain, and accelerate the development of a more cohesive and efficient collaborative innovation ecosystem.
Chengdu Image Design Technology Co., Ltd. (hereafter "Chengdu Image Design"), as an investor in the Anzhixin Platform and a member unit of the alliance, has earned recognition from industry partners for its sustained efforts in advancing the localization of automotive chips, its pivotal role in driving semiconductor industry development, and its demonstrated technical expertise in integrated circuits. At the recent China Automotive Chip Industry Innovation Strategic Alliance (CACISA) General Assembly, Chengdu Image Design was honored as the Vice Chair of the Alliance Council. Concurrently, Dr. Wang Yong, Executive Vice President of Chengdu Image Design, was appointed as a member of the Alliance's Expert Group, leveraging his extensive industry experience and specialized knowledge. Specializing in CMOS image sensors, Chengdu Image Design is a leading domestic supplier of fully autonomous imaging solutions, renowned for its technological differentiation. Its product portfolio spans automotive, security surveillance, consumer electronics, industrial vision, medical endoscopy, and scientific customization. Notably, its MIA series chips for automotive applications deliver stable performance in complex driving environments, providing high-definition and reliable image data for critical systems such as Advanced Driver Assistance Systems (ADAS) and Driver Monitoring Systems (DMS). These innovations significantly enhance driving safety and accelerate the development of autonomous driving technologies
At the highly anticipated "China Core" Supply-Demand Matchmaking Conference held on the same day, numerous automakers, Tier 1 suppliers, and domestic automotive chip companies gathered to explore new collaboration opportunities. Liu Hao, Vice President of Chengdu Image Design Technology Co., Ltd. (hereafter "Chengdu Image Design"), presented the company's technological advancements and product strengths in automotive CMOS Image Sensor (CIS) chips, attracting significant attention from major OEMs including SAIC Motor, Dongfeng Motor, Great Wall Motor, Chery, FAW Group, JAC Motors, and Xiaomi.
